לחברת הייטק באזור המרכז / השרון דרוש/ה - IC Assembly / Packaging Expert /Senior
Responsibilities: · Development of assembly and packaging solutions for advanced ICs · Development of IC assembly solution for end customers · Management and audit of worldwide assembly vendors · Assembly quality assurance.
Requirements: · B.Sc or M.Sc in Electrical or Material Engineering. Possibility for practical engineer with applicable experience. · At least 5 years experience in IC packaging. · Knowledge of advanced assembly technologies, lead frame and substrate based packages, chip scale packages, chip-on-board technologies. · Willingness to travel abroad